Brief: Our team walks you through how the Intel EP4CGX22CF19C8N FPGA chip performs in common scenarios. This video provides a detailed demonstration of its 150 I/O capabilities, 324FBGA packaging, and application as a non-isolated PoL module DC converter in various electronic systems.
Related Product Features:
High-performance Intel FPGA with 150 I/O interface for complex electronic applications.
Features 324FBGA package type designed for tray mounting and easy integration.
Operates as a non-isolated Point-of-Load (PoL) module DC converter for power management.
Manufactured by Intel with original quality assurance and rigorous testing standards.
Suitable for diverse applications including consumer electronics, automotive systems, and telecommunications.
Stable voltage handling capabilities ensure reliable performance across various operating conditions.
Available in tray packaging with current stock of 5000 units for immediate deployment.
Versatile mounting compatibility allows for straightforward implementation in multiple device configurations.
FAQs:
What is the manufacturer and part number of this FPGA chip?
This is an Intel FPGA with manufacturer part number EP4CGX22CF19C8N.
What package type and I/O configuration does this IC chip feature?
The chip comes in a 324FBGA package and provides 150 I/O interfaces for comprehensive connectivity.
How is this IC chip packaged for shipping and what is the available stock?
The chips are packaged in trays for secure shipping, with a current stock availability of 5000 pieces.
What type of power conversion does this module provide?
It functions as a non-isolated Point-of-Load (PoL) module DC converter for efficient power management in electronic systems.